| 过焦扫描光学显微测量技术综述 |
| Review of through-focus scanning optical microscopy |
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| 中文摘要: |
| 随着半导体产业的发展和器件性能的不断提升，半导体器件的特征尺寸越来越小，器件结构越来越复杂，对检测仪器的性能提出了更高的要求。首先介绍过焦扫描光学显微法（Through-focus Scanning Optical Microscope，TSOM）的测量装置及测量原理，该方法可实现三维几何参数的无损测量，因其具有精度高、速度快、成本低等优点，可以满足在线测量的需求；然后从TSOM图构建和待测参数提取两个方面对TSOM方法的研究进展进行了梳理和归纳；最后对TSOM方法未来的研究重点和发展方向进行了展望。该方法有望为我国半导体制造产业提供新的检测手段，为优化和提升我国半导体制造工艺提供重要的技术支撑。 |
| 英文摘要: |
| As the semiconductor industry develops and the device performance improves continuously, the feature size of semiconductor devices is becoming smaller and smaller, and the device structure is becoming more and more complex. Therefore, it urgently demands for the high performance of metrological instruments. This paper first introduces the measurement principle and the setup of through-focus scanning optical microscope (TSOM) method. This method can realize the nondestructive measurement of 3D geometric parameters, and has the advantages of high precision, fast speed, low cost, etc. It can meet the requirements of online applications. Then the paper introduces the research progress of TSOM method from two aspects: the construction of TSOM image and the extraction of structural parameters. Finally, it prospects the future research focus and development direction of TSOM method. This method is hopefully a new metrology method for China's semiconductor manufacturing industry, and provide important technical support for optimizing and upgrading China's semiconductor manufacturing process. |
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| 中文关键词: 光学微纳测量 过焦扫描光学显微法 深度学习 无损测量 |
| 英文关键词:optical micro-nano measurement through-focus scanning optical microscope deep learning non-destructive measurement |
| 基金项目: |
| DOI：10.11823/j.issn.1674-5795.2023.01.02 |
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