Electron beam inspection equipment plays an important role in the yield monitoring of integrated circuits (IC) manufacture. Combining technologies of scanning electron microscopy, high-precision motion control, high-speed image processing and automatic defect classification, this equipment can inspect physical and electrical defects on IC wafers in IC manufacturing processes. In order to fill in the blank of localization, our team has independently developed the equipment. Key technical breakthroughs in high-resolution large field scanning imaging, 3D high-precision positioning with compensation, AI-assisted defect capture and classification have been made. The localized electron beam inspection equipment have already been developed and used in IC manufacture. This will accelerate the development of IC inspection technology in China.