The connection technique of various microparts is the key to improve the microsystem integration. The adhesion connection with high-viscosity adhesive presents the advantages, including simple operation, weak internal stress, no requirement of high temperature and pressure. Thus the adhesion connection has gradually become an important bonding method for high performance microsystems. The micro-dispensing of high-viscosity liquid has significant influence on the bonding performance. Since the flow resistance of high-viscosity liquid tube injection system is very high, the improvements on driving mode etc. are necessary for the micro-dispensing of high-viscosity adhesive in specific occasions. But the problem of high flow resistance has not been completely solved. The transfer dispensing method of the liquid mainly depends on the adhesion and transfer pressure between the transfer head, liquid and substrate surface. This method eliminates the restriction of the flow resistance in the tube, and does not need the high driving force, which is beneficial to the micro-dispensing of the high-viscosity liquid. In this paper, the mechanism of high-viscosity liquid micro-transferring is introduced. And the progress on both high viscosity droplet-loading and droplet-transferring are presented. At last, the development trends are prospected.