融合失效物理与虚拟试验的MEMS传感器寿命预测方法
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Life prediction method for MEMS sensors integrating physics of failure and virtual testing
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    摘要:

    针对高可靠MEMS传感器整机寿命验证中存在的加速试验成本高、现有虚拟方法缺乏系统性建模与不确定性量化等问题,提出一种基于失效物理(Physics of Failure, PoF)的虚拟评估框架。通过多尺度数字样机与热-振耦合仿真获取局部应力,并构建模块化PoF模型库以预测关键器件关键失效模式的寿命。为量化制造工艺与服役环境中的不确定性,引入一种物理来源驱动的混合概率分布建模策略。在此基础上,建立“器件内多模式融合”与“器件间首达失效”两级竞争失效模型,以预测整机首达故障时间(Time-to-Failure, TTF)。以MPU9250为例进行验证,自主开展的热-振联合物理试验表明:数字样机精度良好(壳温偏差不超过± 0.2 ℃,模态误差< 5%),预测整机TTF为12 721 h,并准确识别出薄弱环节。该方法能有效减少对物理试验的依赖,提升寿命评估的效率与可信度。

    Abstract:

    Aiming at the problems of high acceleration test cost and the lack of systematic modeling and uncertainty quantification in existing virtual methods for the life verification of high-reliability MEMS sensor complete machines, this paper proposes a virtual assessment framework based on Physics of Failure (PoF). This method obtains local stress through multi-scale digital prototyping and thermal-vibration coupling simulation, and constructs a modular PoF model library to predict the life of key failure modes of critical devices. To quantify the uncertainty in manufacturing processes and service environments, a physical source-driven hybrid probability distribution modeling strategy is introduced. On this basis, a two-level competitive failure model consisting of "intra-device multi-mode fusion" and "inter-device first-passage failure" is established to realize the prediction of the Time-to-Failure (TTF) of the complete machine. Taking the MPU9250 as an example for verification, the independently conducted thermal-vibration combined physical test shows that the digital prototype has satisfactory accuracy (case temperature deviation shall not exceed ± 0.2℃, modal error < 5%), the predicted TTF of the complete machine is 12 721 h, and the weak link is accurately identified. The results show that the proposed method can effectively reduce the dependence on physical tests and improve the efficiency and credibility of life assessment.

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于紫玄.融合失效物理与虚拟试验的MEMS传感器寿命预测方法[J].计测技术,2026,46(3):42~51:
10.11823/j. issn.1674-5795.2026.03.06.

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  • 在线发布日期: 2026-07-02
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