Current full-field spectral-domain interferometry relies on wavelength or galvanometer scanning, which limits its ability to acquire full-field information in a single detection. To address this issue, this paper proposes a full-field spectral-domain interferometry technique based on a Digital Micromirror Device (DMD). By encoding the spatial light field distribution via the DMD, time-varying spectral signals corresponding to sequentially loaded masks are acquired, which are further decoded to obtain the amplitude response at each spatial pixel. Combined with the measurement algorithm, full-field information retrieval is achieved. Experimental results demonstrate that the proposed technique enables high-precision spectral interferometric distance measurement and spectroscopic ellipsometric film thickness measurement, while significantly improving full-field measurement efficiency. The DMD-based full-field spectral interferometry technique is suitable for rapid three-dimensional structure recovery and reconstruction of sparse surfaces, providing strong support for efficient thickness and topography characterization of polished wafers, Silicon-On-Insulator (SOI) substrates, and bonded interfaces.