时速350 km及以上高铁的牵引和制动系统压力传感器芯片设计优化
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Pressure sensor chip fabrication and optimization for traction and braking systems in high-speed trains with speeds of 350 km / h and above
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    摘要:

    为应对高铁牵引与制动系统中复杂工况对压力传感器在高精度、宽动态范围及快速响应方面的严苛要求,本研究团队基于压阻效应机理,开展了高精度压力传感器芯片的制造与优化技术攻关。运用多物理场耦合建模理论,结合结构参数优化方法,系统研究了敏感膜片厚度、压敏电阻布局与掺杂浓度对传感器性能的协同影响机制,提出基于参数化设计方法的膜片刚度-灵敏度协同优化策略。通过开发八层掩膜版光刻工艺与氢氧化钾 / 异丙醇(Potassium Hydroxide / Isopropyl Alcohol, KOH / IPA)复合湿法刻蚀技术,实现悬膜厚度亚微米级控制精度。研究结果表明:优化后的传感器在灵敏度、非线性误差及过载耐受能力方面表现优异,灵敏度达到56.987 mV / kPa,非线性误差为0.048% FS(Full Scale, 满量程),并在300%过载工况下仍保持结构完整性。本研究为高精度压力芯片的制造与优化提供了理论依据和技术支持,为保障高铁列车安全运行与核心部件国产化替代提供了关键技术支撑。

    Abstract:

    To meet the stringent requirements for high accuracy, wide dynamic range, and rapid response of pressure sensors under the complex operating conditions of high-speed train traction and braking systems, this study presents the design, fabrication, and multiphysics optimization of a high-performance piezoresistive pressure sensor chip. By emplo-ying multiphysics coupling modeling theory in combination with a structural parameter optimization approach, this study systematically investigates the synergistic influence of diaphragm thickness, piezoresistor layout, and doping concentration on sensor performance, and proposes a parameterization-based stiffness-sensitivity co-optimization strategy for the diaphragm. Furthermore, by developing an eight-mask photolithography process and a composite wet etching technique based on KOH / IPA, a submicron-level control accuracy of diaphragm thickness was achieved. Finite element simulation results demonstrate a sensitivity of 56.987 mV / kPa, a nonlinearity of 0.048% FS, and structural stability under 300% overpressure. This work addresses a key technological bottleneck in high-accuracy pressure sensor fabrication and lays the foundation for fully localized production of safety-critical sensing components in next-generation traction systems for high-speed train.

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郑德智, 董晓源, 陈傲北, 孙颖, 胡纯, 王帅.时速350 km及以上高铁的牵引和制动系统压力传感器芯片设计优化[J].计测技术,2025,45(5):108~117:
10.11823/j. issn.1674-5795.2025.05.11.

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  • 在线发布日期: 2025-11-10
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