Research on Thermal Resistance Correction Model of Thin Film Thermocouple Based on CFD Technology
CSTR:
Author:
Affiliation:

Clc Number:

Fund Project:

  • Article
  • |
  • Figures
  • |
  • Metrics
  • |
  • Reference
  • |
  • Related
  • |
  • Cited by
  • |
  • Materials
  • |
  • Comments
    Abstract:

    Aiming at the field calibration problem of using thin-film thermocouple to measure the surface temperature, the CFD numerical simulation and Experimental Research on the measurement error caused by the thickness of adhesive layer under different surface temperatures are carried out. The corresponding relationship between the surface temperature, adhesive layer thickness and thermal resistance correction is obtained. On this basis, the thermal resistance correction model is established, which is represented by the curve. The experiments were designed to verify it. The results show that: under the same adhesive layer thickness, the temperature measurement deviation increases with the increase of the difference between the surface temperature and the ambient temperature, which is consistent with the experimental results; under the same surface temperature, the thinner the adhesive layer thickness, the smaller the temperature measurement deviation, which is also consistent with the actual situation.

    Reference
    Related
    Cited by
Get Citation
Related Videos

Share
Article Metrics
  • Abstract:
  • PDF:
  • HTML:
  • Cited by:
History
  • Received:
  • Revised:
  • Adopted:
  • Online: April 08,2021
  • Published:
Article QR Code